Manufacturing of PCB has been made simple with the introduction of technology in design and preparation. This innovative approach allows manufacturers to achieve better and more precise results. You will be required to get an appropriate photo resist board that has plastic reinforcements on glass. One of the faces of this board is photo sensitive and coated with copper. This surface is initially covered with a plastic film.
You will then place the now transparent printed circuit board beneath the photo resist board. They should be of exact same size. The surface is sensitive after the removal of the plastic film. Placing the mask in the right way-up ensures that the tracks do not end up facing the wrong direction. The board is then ready for transfer into the UV light box.
An appropriate cover for the box should be sort to make it effective. Your board should be in the box for around two and half minutes after which it is removed. Plastic tongs should be used in handling the board considering that it is delicate during manufacture. It is then transferred into a specially prepared development box for about ten seconds. Allowing it to stay more than that exposes it to damage. The tracks may be destroyed completely.
Plastic tongs are used to hold the board during all these operations. It is transferred into an etching tank after carefully washing in clean water. Heating allows the bubble etch tank to complete a very important process. The process involves etching away all unwanted copper materials. You will only be left with carefully drawn tracks. Success during this stage demands constant checks.
Etching will take approximately fifteen minutes. Under-etching exposes the board incomplete development while it will get damaged when etching is overdone. The tracks are likely to be removed in the process. The process of manufacture should be monitored by the minute and will eventually be mastered.
Technology has simplified the process of design since a Computer Aided Design system or Auto CAD may be used. The data is easier to in-script and transfer to manufacturers. This automated system defines and earmarks your copper layers. It makes it easier and clear to identify soldier marks and component notifications.
A controlled dark room makes preparation of photo tools easier. This is done using laser driven photoplotters. The room has the right temperature and humidity conditions for work. Converting the data used in manufacture of the images into a pixel image simplifies the process of manufacture. The film is written using a laser writer. The film is ready for unloading by the operator after automatic film development.
Manufacturing of PCB is not complete until profiling or V-cut scoring is done. This is done from the production panel. A scoring machine is used in this process. Cutters are either above or below the panel. The cut is made at a third of the entire thickness in order to leave a film that connects the board together. The board is then checked thoroughly by an experienced person to ensure that everything is in order.
You will then place the now transparent printed circuit board beneath the photo resist board. They should be of exact same size. The surface is sensitive after the removal of the plastic film. Placing the mask in the right way-up ensures that the tracks do not end up facing the wrong direction. The board is then ready for transfer into the UV light box.
An appropriate cover for the box should be sort to make it effective. Your board should be in the box for around two and half minutes after which it is removed. Plastic tongs should be used in handling the board considering that it is delicate during manufacture. It is then transferred into a specially prepared development box for about ten seconds. Allowing it to stay more than that exposes it to damage. The tracks may be destroyed completely.
Plastic tongs are used to hold the board during all these operations. It is transferred into an etching tank after carefully washing in clean water. Heating allows the bubble etch tank to complete a very important process. The process involves etching away all unwanted copper materials. You will only be left with carefully drawn tracks. Success during this stage demands constant checks.
Etching will take approximately fifteen minutes. Under-etching exposes the board incomplete development while it will get damaged when etching is overdone. The tracks are likely to be removed in the process. The process of manufacture should be monitored by the minute and will eventually be mastered.
Technology has simplified the process of design since a Computer Aided Design system or Auto CAD may be used. The data is easier to in-script and transfer to manufacturers. This automated system defines and earmarks your copper layers. It makes it easier and clear to identify soldier marks and component notifications.
A controlled dark room makes preparation of photo tools easier. This is done using laser driven photoplotters. The room has the right temperature and humidity conditions for work. Converting the data used in manufacture of the images into a pixel image simplifies the process of manufacture. The film is written using a laser writer. The film is ready for unloading by the operator after automatic film development.
Manufacturing of PCB is not complete until profiling or V-cut scoring is done. This is done from the production panel. A scoring machine is used in this process. Cutters are either above or below the panel. The cut is made at a third of the entire thickness in order to leave a film that connects the board together. The board is then checked thoroughly by an experienced person to ensure that everything is in order.
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